Physics-informed neural network and reinforcement learning algorithm for device-side debonding of a 35 μm-thick wafer with zero debonding force

Authors

Y. T. Kim, M. Lee, W S. Lee, H. Choi, W. S. Chang, Y. kim, J. Kim, Jong. G, Ok

Journal

International Journal Of Extreme Manufacturing

Vol. (No.), pp.

Submitted (Sep 2026)

Year

Under Review